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X006 数据表(PDF) 7 Page - STMicroelectronics |
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X006 数据表(HTML) 7 Page - STMicroelectronics |
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7 / 9 page ![]() X006 Package information 7/9 3 Package information ● Epoxy meets UL94, V0 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Table 4. TO-92 (plastic) dimensions Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 1.35 0.053 B 4.70 0.185 C 2.54 0.100 D 4.40 0.173 E 12.70 0.500 F 3.70 0.146 a 0.50 0.019 Table 5. SOT-223 dimensions Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 1.80 0.071 A1 0.02 0.10 0.001 0.004 B 0.60 0.70 0.85 0.024 0.027 0.033 B1 2.90 3.00 3.15 0.114 0.118 0.124 c 0.24 0.26 0.35 0.009 0.010 0.014 D(1) 1. Do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm (0.006inches) 6.30 6.50 6.70 0.248 0.256 0.264 e2.3 0.090 e1 4.6 0.181 E(1) 3.30 3.50 3.70 0.130 0.138 0.146 H 6.70 7.00 7.30 0.264 0.276 0.287 V10° max A F C B a DE A A1 e1 D B1 H E e 12 4 3 B V c |
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