X006 datasheet(4/9 Pages) STMICROELECTRONICS

4 / 9 page

Characteristics

X006

4/9

Figure 5.

Average and DC on-state current

versus ambient temperature (epoxy

PCB FR4, copper

thickness = 35 µm, SCU = 5 cm

(SOT-223)

Figure 6.

Relative variation of thermal

impedance junction to ambient

versus pulse duration (PCB FR4,

copper thickness = 35 µm, SCU = 0.5

cm2) (TO-92)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

100

125

(A)

T(AV)

(°C)

amb

α = 180°

D.C.

SOT-223

= 0.5 cm

0.01

0.10

1.00

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

Z/R

th(j-a)

t (s)

TO-92

= 0.5 cm

Figure 7.

Relative variation of thermal

impedance junction to ambient

versus pulse duration (PCB FR4,

copper thickness = 35 µm, SCU = 0.5

cm2) (SOT-223)

Figure 8.

Thermal resistance junction to

ambient versus copper surface

under tab (PCB FR4, copper

thickness = 35 µm) (SOT-223)

0.01

0.10

1.00

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

Z/R

th(j-a)

t (s)

SOT-223

= 0.5 cm

100

110

120

130

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

S(cm²)

(°C/W)

th(j-a)

Figure 9.

Relative variation of gate trigger

current, holding current and

latching current versus junction

temperature (typical values)

Figure 10.

Relative variation of holding

current versus gate-cathode

resistance (typical values)

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

-40 -30 -20 -10

90 100 110 120 130

T (°C)

I,I ,I [T ] /

GT H L

,I ,I [T =25°C]

GT H L

IGT

IH & IL

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

R(k )

I [R

] / I [

=1k ]

HGK

RGK

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