Ordering information

ESDALC6V1F2

6/7

Figure 11.

Flip-Chip tape and reel specifications

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

4

Ordering information

5

Revision history

Dot identifying Pin A1 location

User direction of unreeling

All dimensions in mm

4 ± 0.1

4 ± 0.1

Ø 1.5 ± 0.1

0.73 ± 0.05

xxz

yww

ST

xxz

yww

ST

xxz

yww

ST

E

E

E

Table 5.

Ordering information

Part number

Marking

Package

Weight

Base qty

Delivery mode

ESDALC6V1F2

ED

Flip-Chip

2.1 mg

5000

Tape and reel

Table 6.

Revision history

Date

Revision

Changes

07-Aug-2006

1

Initial release.

11-Jul-2007

2

Updated marking from EDT to ED.