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ESDALC6V1F2 数据表(PDF) 5 Page - STMicroelectronics |
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ESDALC6V1F2 数据表(HTML) 5 Page - STMicroelectronics |
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5 / 7 page ![]() ESDALC6V1F2 Package information 5/7 3 Package information Figure 8. Flip-Chip dimensions Figure 9. Flip-Chip footprint Figure 10. Marking 0.95 mm ± 50 µm 315 µm ± 50 500 µm ± 10 250 µm ± 10 650 µm ± 50 Copper pad Diameter : 250µm recommended , 300µm max Solder stencil opening : 330µm Solder mask opening recommendation : 340µm min for 315µm copper pad diameter Dot, ST logo xx = marking yww = datecode (y = year ww = week) z = manufacturing location x y x w z w E |
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