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STE2007 数据表(PDF) 60 Page - STMicroelectronics |
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STE2007 数据表(HTML) 60 Page - STMicroelectronics |
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60 / 62 page  Chip mechanical drawing STE2007 60/62 10 Chip mechanical drawing Figure 40. Alignment marks dimensions Table 54. Mechanical dimensions Parameter Dimensions Wafer Thickness 500 µm Die Size (X x Y) 5.92 mm x 1.29 mm Bumps Size on Columns and Segments Side 28 µm X 89 µm X 15 Pad Size on Columns and Segments Side 35 µm X 96µm Bumps Pitch on Columns and Segments Side 45 µm Bumps Size on Interfaces Side 55 µm X 73µm X 15 Pad Size on Interfaces Side 64 µm X 82 µm Bumps Pitch on Interfaces Side 72 µm Spacing between Bumps 17 µm Table 55. Alignment marks coordinates MARKS X Y Mark1 -2834.55 517.05 Mark2 2834.55 517.05 Mark3 -2834.55 -517.05 Mark4 2834.55 -517.05 Mark5 2205.0 517.05 85 µm 35 µm |
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