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STPC4EEBC 数据表(PDF) 61 Page - STMicroelectronics |
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STPC4EEBC 数据表(HTML) 61 Page - STMicroelectronics |
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61 / 93 page  MECHANICAL DATA Release 1.5 - January 29, 2002 61/93 Figure 5-6. Thermal Dissipation With Heatsink Board Ambient Case Junction Board Ambient Ambient Case Junction Board Rca Rjc Rjb Rba 36 50 8.5 Rja = 9.5 °C/W Airflow = 0 Board dimensions: The PBGA is centred on board Copper thickness: - 17µm for internal layers - 34µm for external layers - 10.2 cm x 12.7 cm - 4 layers (2 for signals, 1 GND, 1VCC) There are no other devices Heat sink is 11.1°C/W 1 via pad per ground ball (8-mil wire) 40% copper on signal layers Board temperature taken at the centre balls |
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