| 数据搜索系统,热门电子元器件搜索 |
|
33982 数据表(PDF) 28 Page - Freescale Semiconductor, Inc |
|
|
|||||||||||||||||||||||||||||
33982 数据表(HTML) 28 Page - Freescale Semiconductor, Inc |
|
28 / 35 page ![]() Analog Integrated Circuit Device Data 28 Freescale Semiconductor 33982 PACKAGING SOLDERING INFORMATION PACKAGING SOLDERING INFORMATION SOLDERING INFORMATION The 33982B is packaged in a surface mount power package intended to be soldered directly on the printed circuit board. The 33982B was qualified in accordance with JEDEC standards JESD22-A113-B and J-STD-020A. The recommended reflow conditions are as follows: • Convection: 225°C +5.0/-0°C • Vapor Phase Reflow (VPR): 215°C to 219°C • Infrared (IR)/Convection: 225°C +5.0/-0°C The maximum peak temperature during the soldering process should not exceed 230°C. The time at maximum temperature should range from 10s to 40s maximum. |
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |