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33982 数据表(PDF) 32 Page - Freescale Semiconductor, Inc |
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33982 数据表(HTML) 32 Page - Freescale Semiconductor, Inc |
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32 / 35 page ![]() Analog Integrated Circuit Device Data 32 Freescale Semiconductor 33982 ADDITIONAL DOCUMENTATION THERMAL ADDENDUM (REV 3.0) Figure 14. Thermal Test Board Device on Thermal Test Board RθJA is the thermal resistance between die junction and ambient air. This device is a dual die package. Index m indicates the die that is heated. Index n refers to the number of the die where the junction temperature is sensed. HS HS 16 15 VPWR 14 GND 13 1 11 10 9 8 7 6 5 4 3 2 12 16-Pin PQFN 0.90 mm Pitch 12.0 mm x 12.0 mm Body 33982B Pin Connections Transparent Top View A A Material: Single layer printed circuit board FR4, 1.6mm thickness Cu traces, 0.07mm thickness Outline: 80mm x 100mm board area, including edge connector for thermal testing Area A: Cu heat-spreading areas on board surface Ambient Conditions: Natural convection, still air Table 19. Thermal Resistance Performance Thermal Resistance Area A (mm2) 1 = Power Chip, 2 = Logic Chip ( °C/W) m = 1, n = 1 m = 1, n = 2 m = 2, n = 1 m = 2, n = 2 RθJAmn 055 42 74 300 41 32 66 600 39 29 65 |
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