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M24C01WDS3TG 数据表(PDF) 27 Page - STMicroelectronics |
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M24C01WDS3TG 数据表(HTML) 27 Page - STMicroelectronics |
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27 / 34 page ![]() M24C16, M24C08, M24C04, M24C02, M24C01 Package mechanical 27/34 Figure 14. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead 2 x 3 mm, outline 1. Drawing is not to scale. 2. The central pad (the area E2 by D2 in the above illustration) is pulled, internally, to VSS. It must not be allowed to be connected to any other voltage or signal line on the PCB, for example during the soldering process. 3. The circle in the top view of the package indicates the position of pin 1. Table 19. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead 2 x 3 mm, data Symbol millimeters inches Typ Min Max Typ Min Max A 0.55 0.50 0.60 0.022 0.020 0.024 A1 0.02 0.00 0.05 0.001 0.000 0.002 b 0.25 0.20 0.30 0.010 0.008 0.012 D 2.00 1.90 2.10 0.079 0.075 0.083 D2 1.60 1.50 1.70 0.063 0.059 0.067 ddd 0.08 0.003 E 3.00 2.90 3.10 0.118 0.114 0.122 E2 0.20 0.10 0.30 0.008 0.004 0.012 e0.50– – 0.020 – – L 0.45 0.40 0.50 0.018 0.016 0.020 L1 0.15 0.006 L3 0.30 0.012 D E UFDFPN-01 A A1 ddd L1 e b D2 L E2 L3 |
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