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M24C01WDS3TG 数据表(PDF) 28 Page - STMicroelectronics |
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M24C01WDS3TG 数据表(HTML) 28 Page - STMicroelectronics |
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28 / 34 page ![]() Package mechanical M24C16, M24C08, M24C04, M24C02, M24C01 28/34 Figure 15. TSSOP8 – 8 lead thin shrink small outline, package outline 1. Drawing is not to scale. 2. The circle in the top view of the package indicates the position of pin 1. Table 20. TSSOP8 – 8 lead thin shrink small outline, package mechanical data Symbol millimeters inches Typ. Min. Max. Typ. Min. Max. A 1.200 0.0472 A1 0.050 0.150 0.0020 0.0059 A2 1.000 0.800 1.050 0.0394 0.0315 0.0413 b 0.190 0.300 0.0075 0.0118 c 0.090 0.200 0.0035 0.0079 CP 0.100 0.0039 D 3.000 2.900 3.100 0.1181 0.1142 0.1220 e 0.650 – – 0.0256 – – E 6.400 6.200 6.600 0.2520 0.2441 0.2598 E1 4.400 4.300 4.500 0.1732 0.1693 0.1772 L 0.600 0.450 0.750 0.0236 0.0177 0.0295 L1 1.000 0.0394 α 0° 8° 0° 8° TSSOP8AM 1 8 CP c L E E1 D A2 A α e b 4 5 A1 L1 |
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