TS5070FN datasheet(14/32 Pages) STMICROELECTRONICS

14 / 32 page

APPLICATION INFORMATION

Figure 2 shows a typical application of the TS5070

together with a transformer SLIC.

The design of the transformer is greatly simplified

due to the on-chip hybrid balance cancellation filter.

Only one single secondary winding is required (see

application note AN.091 - Designing a subscriber

line card module using the TS5070/COMBO IIG).

Figures 3 and 4 show an arrangement with SGS-

Thomson monolithic SLICS.

POWER SUPPLIES

While the pins of the TS5070 and TS5071/COMBO

IIG devices are well protected against electrical

misuse, it is recommended that the standard

CMOS practice of applying GND to the device be-

fore any otherconnectionsare made shouldalways

be followed.In applicationswhere the printedcircuit

card may be plugged into a hot socket with power

and clocks already present, an extra long ground

pin on the connector should be used and a Schottky

diode connected between VSS and GND. To mini-

mize noise sources all ground connections to each

device should meet at a common point as close as

possible to the GND pin in order to prevent the in-

teraction of ground return currents flowing through

a common bus impedance. Power supply decou-

pling capacitors of 0.1

µF shouldbe connectedfrom

this common device ground point to VCC and VSS

as closeto thedevice pins as possible. VCC and VSS

should also be decoupled with low effective series

resis-tance capacitorsof at least 10

µF locatednear

the card edge connector.

TS5070 - TS5071

14/32

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