MPC8313VRGDFB datasheet(82/100 Pages) FREESCALE

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MPC8313E PowerQUICC™ II Pro Processor Hardware Specifications, Rev. 2.1

Freescale Semiconductor

Thermal

20.3

Example Clock Frequency Combinations

Table 69 shows several possible frequency combinations that can be selected based on the indicated input

reference frequencies, with RCWLR[LBCM] = 0 and RCWLR[DDRCM] =1, such that the LBC operates

with a frequency equal to the frequency of csb_clk and the DDR controller operates at twice the frequency

of csb_clk.

21 Thermal

This section describes the thermal specifications of the MPC8313E.

21.1

Thermal Characteristics

Table 70 provides the package thermal characteristics for the 516, 27

× 27 mm TEPBGAII.

Table 69. System Clock Frequencies

LBC(lbc_clk)

e300 Core(core_clk)

SYS_

CLK_IN/

PCI_CLK

SPMF1

1 System PLL multiplication factor.

VCOD2

2 System PLL VCO divider.

VCO3

3 When considering operating frequencies, the valid core VCO operating range of 400–800 MHz must not be violated.

CSB

(

csb_clk)4

4 Due to erratum eTSEC40, csb_clk frequencies of less than 133 MHz do not support gigabit Ethernet data rates. The core

frequency must be 333 MHz for gigabit Ethernet operation. This erratum will be fixed in revision 2 silicon.

DDR

(ddr_clk)

USB

ref5

5 Frequency of USB PLL input reference.

× 1

× 1.5 × 2 × 2.5 × 3

25.0

600.0

150.0

300.0

—

37.5

18.8

Note 6

6 USB reference clock must be supplied from a separate source as it must be 24 or 48 MHz, the USB reference must be

supplied from a separate external source using USB_CLK_IN.

150.0

225

300

375

—

25.0

500.0

125.0

250.0

62.5 31.25 15.6

Note 6

125.0

188

250

313

375

33.3

666.0

166.5

333.0

—

41.63 20.8

Note 6

166.5

250

333

—

33.3

532.8

133.2

266.4

66.6

33.3

16.7

Note 6

133.2

200

266

333

400

48.0

576.0

144.0

288.0

—

18.0

48.0

144.0

216

288

360

—

66.7

533.4

133.3

266.7

66.7 33.34 16.7

Note 6

133.3

200

267

333

400

Table 70. Package Thermal Characteristics for TEPBGAII

Characteristic

Board Type

Symbol

TEPBGA II

Unit

Notes

Junction-to-ambient natural convection

Single layer board (1s)

RθJA

°C/W

1, 2

Junction-to-ambient natural convection

Four layer board (2s2p)

RθJA

°C/W

1, 2, 3

Junction-to-ambient (@200 ft/min)

Single layer board (1s)

RθJMA

°C/W

1, 3

Junction-to-ambient (@200 ft/min)

Four layer board (2s2p)

RθJMA

°C/W

1, 3

Junction-to-board

—

RθJB

°C/W

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