LT3513

19

3513fa

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

UHF Package

38-Lead Plastic QFN (5mm

× 7mm)

(Reference LTC DWG # 05-08-1701 Rev C)

5.00

0.10

NOTE:

1. DRAWING CONFORMS TO JEDEC PACKAGE

OUTLINE M0-220 VARIATION WHKD

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

PIN 1

TOP MARK

(SEE NOTE 6)

37

1

2

38

BOTTOM VIEW—EXPOSED PAD

5.50 REF

5.15 ± 0.10

7.00

0.10

0.75

0.05

R = 0.125

TYP

R = 0.10

TYP

0.25

0.05

(UH) QFN REF C 1107

0.50 BSC

0.200 REF

0.00 – 0.05

RECOMMENDED SOLDER PAD LAYOUT

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

3.00 REF

3.15 ± 0.10

0.40 0.10

0.70

0.05

0.50 BSC

5.5 REF

3.00 REF

3.15 ± 0.05

4.10

0.05

5.50

0.05

5.15 ± 0.05

6.10

0.05

7.50

0.05

0.25

0.05

PACKAGE

OUTLINE

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1 NOTCH

R = 0.30 TYP OR

0.35

45 CHAMFER

PACKAGE DESCRIPTION