BLF574_2

© NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 02 — 24 February 2009

7 of 18

NXP Semiconductors

BLF574

HF / VHF power LDMOS transistor

7.1.3 Application circuit

[1]

American Technical Ceramics type 100B or capacitor of same quality.

Table 8.

List of components

For application circuit, see Figure 7.

Printed-Circuit Board (PCB): Rogers 5880;

metallization); thickness copper plating = 35

µm.

Component

Description

Value

Remarks

C1, C2,

C23, C24

multilayer ceramic chip capacitor 100 pF

[1]

C3

multilayer ceramic chip capacitor 24 pF

[1]

C4, C5

multilayer ceramic chip capacitor 39 pF

[1]

C6, C9

multilayer ceramic chip capacitor 4.7

µF

TDK4532X7R1E475Mt020U

C7, C8,

C10, C11

multilayer ceramic chip capacitor 1 nF

[1]

C12, C16

electrolytic capacitor

220

µF; 63 V

C13, C15

multilayer ceramic chip capacitor 62 pF

[1]

C14

multilayer ceramic chip capacitor 15 pF

[1]

C17, C19

multilayer ceramic chip capacitor 47 pF

[1]

C18

multilayer ceramic chip capacitor 33 pF

[1]

C20, C22

multilayer ceramic chip capacitor 10 pF

[1]

C21

multilayer ceramic chip capacitor 18 pF

[1]

L1, L2,

L3, L4

3 turns 1 mm copper wire

D = 3 mm;

length = 3 mm

L5, L6

stripline

-

(L

× W) 125 mm × 7mm

L7, L8,

L9, L10

stripline

-

(L

× W) 8 mm × 15 mm

L11, L12

stripline

-

(L

× W) 132 mm × 7mm

R1, R2

metal film resistor

10

Ω; 0.6 W

R3, R4

metal film resistor

3

Ω; 0.6 W

T1, T2,

T3, T4

semi rigid coax

50

Ω; 120 mm

EZ-141-AL-TP-M17