BLF574_2

© NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 02 — 24 February 2009

13 of 18

NXP Semiconductors

BLF574

HF / VHF power LDMOS transistor

8.2.3 Test circuit

[1]

American Technical Ceramics type 100B or capacitor of same quality.

Table 10.

List of components

For production test circuit, see Figure 15 and Figure 16.

Printed-Circuit Board (PCB): Rogers 5880;

metallization); thickness copper plating = 35

µm.

Component Description

Value

Remarks

C1, C2,

C20, C21

multilayer ceramic chip capacitor

100 pF

[1]

C3

multilayer ceramic chip capacitor

24 pF

[1]

C4, C5

multilayer ceramic chip capacitor

39 pF

[1]

C6, C7,

C10, C11

multilayer ceramic chip capacitor

1 nF

[1]

C8, C9

multilayer ceramic chip capacitor

4.7

µF

[1] TDK4532X7R1E475Mt020U

C12, C13

electrolytic capacitor

220

µF; 63 V

C14, C15

multilayer ceramic chip capacitor

47 pF

[1]

C16

multilayer ceramic chip capacitor

33 pF

[1]

C17

multilayer ceramic chip capacitor

18 pF

[1]

C18, C19

multilayer ceramic chip capacitor

10 pF

[1]

C22

multilayer ceramic chip capacitor

15 pF

[1]

C23, C24

multilayer ceramic chip capacitor

62 pF

[1]

L1, L2,

L3, L4

3 turns 1 mm copper wire

D = 3 mm;

length = 2 mm

L5, L6

stripline

-

(L

× W) 125 mm × 7mm

L7, L8,

L9, L10

stripline

-

(L

× W) 8 mm × 15 mm

L11, L12

stripline

-

(L

× W) 132 mm × 7mm

R1, R2

metal film resistor

10

Ω; 0.6 W

R3, R4

metal film resistor

3

Ω; 0.6 W

T1, T2,

T3, T4

semi rigid coax

50

Ω; 120 mm

EZ-141-AL-TP-M17