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TNETE2004PAC 数据表(PDF) 44 Page - Texas Instruments |
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TNETE2004PAC 数据表(HTML) 44 Page - Texas Instruments |
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44 / 46 page ![]() TNETE2004 MDIO Managed QuadPHY FOUR 10 BASE-T PHYSICAL LAYER INTERFACES SPWS023D – OCTOBER 1996 – REVISED OCTOBER 1997 44 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA PAC (R-PQFP-G128) PLASTIC QUAD FLATPACK (DIE-DOWN) 4040274 / B 03/95 0,15 NOM 18,00 14,20 13,80 17,20 64 65 39 38 12,50 TYP Heat Slug 1,10 0,70 0,25 Seating Plane 0,10 MIN Gage Plane 0,30 0,10 102 1 18,50 TYP 103 128 24,00 23,20 19,80 20,20 3,10 MAX 2,70 TYP 0 °–10° 0,10 0,50 M 0,08 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Thermally enhanced molded plastic package (HSL) exposed on package bottom D. Contact field sales office to determine if a tighter coplanarity requirement is available for this package. |
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