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ADP8860ACPZ-R7 数据表(PDF) 49 Page - Analog Devices |
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ADP8860ACPZ-R7 数据表(HTML) 49 Page - Analog Devices |
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49 / 52 page ![]() ADP8860 Rev. 0 | Page 49 of 52 OUTLINE DIMENSIONS 0.645 0.600 0.555 1.995 1.955 1.915 A B C D E 1 2 3 4 BOTTOM VIEW (BALL SIDE UP) TOP VIEW (BALL SIDE DOWN) 0.287 0.267 0.247 1.60 REF SEATING PLANE 0.40 REF 0.415 0.400 0.385 0.230 0.200 0.170 0.05 MAX COPLANARITY 2.395 2.355 2.315 BALL A1 IDENTIFIER Figure 47. 20-Ball Wafer Level Chip Scale Package [WLCSP] (CB-20-6) Dimensions shown in millimeters 2.65 2.50 SQ 2.35 3.75 BSC SQ 4.00 BSC SQ 1 0.50 BSC PIN 1 INDICATOR 0.50 0.40 0.30 COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1 TOP VIEW 12° MAX 0.80 MAX 0.65 TYP SEATING PLANE PIN 1 INDICATOR COPLANARITY 0.08 1.00 0.85 0.80 0.30 0.23 0.18 0.05 MAX 0.02 NOM 0.20 REF 20 6 16 10 11 15 5 EXPOSED PAD (BOTTOM VIEW) 0.60 MAX 0.60 MAX 0.25 MIN FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. Figure 48. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 4 mm × 4 mm Body, Very Thin Quad (CP-20-4) Dimensions shown in millimeters |
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