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SPT5510 数据表(PDF) 4 Page - Cadeka Microcircuits LLC. |
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SPT5510 数据表(HTML) 4 Page - Cadeka Microcircuits LLC. |
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4 / 8 page ![]() 4 9/27/00 SPT5510 THEORY OF OPERATION The SPT5510 is a segmented 16-bit current-output DAC. The four MSBs, D15–D12, are decoded to fifteen unit cells (current sinks). The remaining bits (D11–D0) are binary; bits D9–D0 are derived from an R-2R ladder. All cells are laser trimmed for maximum accuracy. The block diagram shows the basic architecture. All output cells are always on, with the data determining whether a given cell’s current is routed from IOUT or IOUT. This provides nearly constant power dissipation indepen- dent of data and clock rate. It also reduces noise transients on power and ground lines. The reference loop utilizes an MSB-weighted cell and pro- vides a gain of about 16 to the output. The on-chip refer- ence amplifier has very high open-loop gain and is offset trimmed to provide a very low temperature drift (typically <10 ppm/ °C gain drift). POWER SUPPLY AND GROUNDING The SPT5510 requires a single –5.2V power supply. All supply pins attach to a common on-chip power bus and should be treated as analog supplies. For best settling per- formance, each supply pin should be decoupled as shown in figure 1 – typical interface circuit. There are three separate on-chip ground busses. DGND pins should be tied together and connected to system ground through a ferrite bead. REFGND and OGND pins should be tied directly to the SPT5510’s ground plane and connected to system ground through a ferrite bead. It is critical that REFGND and OGND are very tightly coupled, as any differential signal (dc offset, noise, etc.) will be transmitted to the output. Two of the OGND pins can be disconnected from the ground plane and used as sense lines for a current-to-voltage converter, as shown in the OUTPUTS section. 1 2 3 4 5 6 7 8 25 26 27 28 29 30 31 32 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 C12 10 pF C13 20 pF 50 IOUT IOUT 41 36 C1–C13 — SURFACE MOUNT CERAMIC CHIP C14–C17 — TANTALUM R1–R6 — CARBON FILM 1/4 W R7–R10 — SURFACE MOUNT CERAMIC CHIP FB — FERRITE BEAD is to be located as closely to the device as possible. SPT5510 AVEE R10 FB AVEE Input Data Output Complementary Output Figure 1 – Typical Interface Circuit |
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