ADCLK948

Rev. 0 | Page 5 of

12

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

Supply Voltage

6 V

Input Voltage

CLK0, CLK1, CLK0, CLK1, IN_SEL

LVPECL Termination)

±40 mA

CLK0, CLK1 to CLK0, CLK1

±1.8 V

and CLK1

±2 V

Maximum Voltage on Output Pins

Maximum Output Current

35 mA

Operating Temperature Range

Ambient

−40°C to +85°C

Junction

150°C

Storage Temperature Range

−65°C to +150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

DETERMINING JUNCTION TEMPERATURE

To determine the junction temperature on the application

printed circuit board (PCB), use the following equation:

where:

the top center of the package.

Ψ

JT

is from Table 6.

and PCB design considerations.

ESD CAUTION

THERMAL PERFORMANCE

Table 6.

Parameter

Symbol

Description

Value1

Unit

Junction-to-Ambient Thermal Resistance

θ

JA

Still Air

Per JEDEC JESD51-2

0 m/sec Air Flow

49.8

°C/W

Moving Air

θ

JMA

Per JEDEC JESD51-6

1 m/sec Air Flow

43.5

°C/W

2.5 m/sec Air Flow

39.0

°C/W

Junction-to-Board Thermal Resistance

θ

JB

Moving Air

Per JEDEC JESD51-8

1 m/sec Air Flow

30.7

°C/W

Junction-to-Case Thermal Resistance

θ

JC

Moving Air

Per MIL-STD 883, Method 1012.1

Die-to-Heatsink

8.8

°C/W

Junction-to-Top-of-Package Characterization Parameter

Ψ

JT

Still Air

Per JEDEC JESD51-2

0 m/sec Air Flow

0.7

°C/W

application to determine if they are similar to those assumed in these calculations.