STM32F103XC datasheet(10/123 Pages) STMICROELECTRONICS

10 / 123 page

Description

STM32F103xC, STM32F103xD, STM32F103xE

10/123

Doc ID 14611 Rev 7

Description

The STM32F103xC, STM32F103xD and STM32F103xE performance line family

incorporates the high-performance ARM® Cortex™-M3 32-bit RISC core operating at a

72 MHz frequency, high-speed embedded memories (Flash memory up to 512 Kbytes and

SRAM up to 64 Kbytes), and an extensive range of enhanced I/Os and peripherals

connected to two APB buses. All devices offer three 12-bit ADCs, four general-purpose 16-

bit timers plus two PWM timers, as well as standard and advanced communication

interfaces: up to two I2Cs, three SPIs, two I2Ss, one SDIO, five USARTs, an USB and a

CAN.

The STM32F103xx high-density performance line family operates in the –40 to +105 °C

temperature range, from a 2.0 to 3.6 V power supply. A comprehensive set of power-saving

mode allows the design of low-power applications.

The STM32F103xx high-density performance line family offers devices in six different

package types: from 64 pins to 144 pins. Depending on the device chosen, different sets of

peripherals are included, the description below gives an overview of the complete range of

peripherals proposed in this family.

These features make the STM32F103xx high-density performance line microcontroller

family suitable for a wide range of applications:

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Motor drive and application control

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Medical and handheld equipment

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PC peripherals gaming and GPS platforms

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Industrial applications, PLC, inverters, printers, and scanners

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Alarm systems, video intercom, and HVAC

Figure 1 shows the general block diagram of the device family.

STM32F103xC 数据表(PDF) 10 Page - STMicroelectronics