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STM32F103xC 数据表(PDF) 35 Page - STMicroelectronics

部件名 STM32F103xC
功能描述  High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces
PDF  123 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STM32F103xC 数据表(HTML) 35 Page - STMicroelectronics

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STM32F103xC, STM32F103xD, STM32F103xE
Pinouts and pin descriptions
Doc ID 14611 Rev 7
35/123
A7
A7 A4 55 89 133
PB3/
I/O FT
JTDO
SPI3_SCK / I2S3_CK/
PB3/TRACESWO
TIM2_CH2 /
SPI1_SCK
A6
A6 B4 56 90 134
PB4
I/O FT
NJTRST
SPI3_MISO
PB4 / TIM3_CH1
SPI1_MISO
B6
C5 A5 57 91 135
PB5
I/O
PB5
I2C1_SMBA/ SPI3_MOSI
I2S3_SD
TIM3_CH2 /
SPI1_MOSI
C6
B5 B5 58 92 136
PB6
I/O FT
PB6
I2C1_SCL(8)/ TIM4_CH1(8)
USART1_TX
D6
A5 C5 59 93 137
PB7
I/O FT
PB7
I2C1_SDA(8) /
FSMC_NADV /
TIM4_CH2(8)
USART1_RX
D5
D5 A6 60 94 138
BOOT0
I
BOOT0
C5
B4 D5 61 95 139
PB8
I/O FT
PB8
TIM4_CH3(8)/SDIO_D4
I2C1_SCL/
CAN_RX
B5
A4 B6 62 96 140
PB9
I/O FT
PB9
TIM4_CH4(8)/SDIO_D5
I2C1_SDA /
CAN_TX
A5
D4
-
-
97 141
PE0
I/O FT
PE0
TIM4_ETR / FSMC_NBL0
A4
C4
-
-
98 142
PE1
I/O FT
PE1
FSMC_NBL1
E5
E5 A7 63 99 143
VSS_3
SVSS_3
F5
F5 A8 64 100 144
VDD_3
SVDD_3
1.
I = input, O = output, S = supply.
2.
FT = 5 V tolerant.
3.
Function availability depends on the chosen device.
4.
If several peripherals share the same I/O pin, to avoid conflict between these alternate functions only one peripheral should
be enabled at a time through the peripheral clock enable bit (in the corresponding RCC peripheral clock enable register).
5.
PC13, PC14 and PC15 are supplied through the power switch. Since the switch only sinks a limited amount of current (3
mA), the use of GPIOs PC13 to PC15 in output mode is limited: the speed should not exceed 2 MHz with a maximum load
of 30 pF and these IOs must not be used as a current source (e.g. to drive an LED).
6.
Main function after the first backup domain power-up. Later on, it depends on the contents of the Backup registers even
after reset (because these registers are not reset by the main reset). For details on how to manage these IOs, refer to the
Battery backup domain and BKP register description sections in the STM32F10xxx reference manual, available from the
STMicroelectronics website: www.st.com.
7.
Unlike in the LQFP64 package, there is no PC3 in the WLCSP package. The VREF+ functionality is provided instead.
8.
This alternate function can be remapped by software to some other port pins (if available on the used package). For more
details, refer to the Alternate function I/O and debug configuration section in the STM32F10xxx reference manual,
available from the STMicroelectronics website: www.st.com.
9.
For the LQFP64 package, the pins number 5 and 6 are configured as OSC_IN/OSC_OUT after reset, however the
functionality of PD0 and PD1 can be remapped by software on these pins. For the LQFP100/BGA100 and
LQFP144/BGA144 packages, PD0 and PD1 are available by default, so there is no need for remapping. For more details,
refer to Alternate function I/O and debug configuration section in the STM32F10xxx reference manual.
10. For devices delivered in LQFP64 packages, the FSMC function is not available.
Table 5.
High-density STM32F103xx pin definitions (continued)
Pins
Pin name
Main
function(3)
(after reset)
Alternate functions(4)
Default
Remap



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