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STM32F103xC 数据表(PDF) 101 Page - STMicroelectronics |
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STM32F103xC 数据表(HTML) 101 Page - STMicroelectronics |
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101 / 123 page  STM32F103xC, STM32F103xD, STM32F103xE Electrical characteristics Doc ID 14611 Rev 7 101/123 Figure 54. Typical connection diagram using the ADC 1. Refer to Table 58 for the values of RAIN, RADC and CADC. 2. Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the pad capacitance (roughly 7 pF). A high Cparasitic value will downgrade conversion accuracy. To remedy this, fADC should be reduced. General PCB design guidelines Power supply decoupling should be performed as shown in Figure 55 or Figure 56, depending on whether VREF+ is connected to VDDA or not. The 10 nF capacitors should be ceramic (good quality). They should be placed them as close as possible to the chip. Figure 55. Power supply and reference decoupling (VREF+ not connected to VDDA) 1. VREF+ and VREF– inputs are available only on 100-pin packages. ai14150c STM32F103xx VDD AINx IL±1 µA 0.6 V VT RAIN(1) Cparasitic VAIN 0.6 V VT RADC(1) 12-bit converter CADC(1) Sample and hold ADC converter VREF+ (see note 1) STM32F103xx VDDA VSSA /VREF– (see note 1) 1 µF // 10 nF 1 µF // 10 nF ai14388b |
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