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STM8L101F2 数据表(PDF) 68 Page - STMicroelectronics |
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STM8L101F2 数据表(HTML) 68 Page - STMicroelectronics |
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68 / 77 page ![]() Package characteristics STM8L101xx 68/77 Doc ID 15275 Rev 7 Figure 41. WFQFPN28 - 28-lead very very thin fine pitch quad flat no-lead package outline (4x4) Figure 42. WFQFPN28 recommended footprint(1)(2) 1. Drawing is not to scale 2. Dimensions are in millimeters DG_ME b 15 21 22 28 1 7 D e b e E ddd ddd L1 14 L2 A1 A A3 Table 41. WFQFPN28 - 28-lead very very thin fine pitch quad flat no-lead package (4 x 4), package mechanical data(1) Dim. mm inches(2) Min Typ Max Min Typ Max A(1) 0.7 0.75 0.8 0.0276 0.0295 0.0315 A1 0 0.02 0.05 0 0.0008 0.002 A3 0.2 0.0079 b 0.18 0.25 0.3 0.0071 0.0098 0.0118 D 4 0.1575 E 4 0.1575 e 0.5 0.0197 L1 0.25 0.35 0.45 0.0098 0.0138 0.0177 L2 0.3 0.4 0.5 0.0118 0.0157 0.0197 ddd 0.08 0.0031 Number of pins N28 1. Thickness valid for the WFQFPN28 package in the sampling phase. In the production phase, the UFQFPN28 package will be used with a thickness equal to 0.6 mm. 2. Values in inches are converted from mm and rounded to 4 decimal digits. |
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