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STM8L101F2 数据表(PDF) 70 Page - STMicroelectronics |
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STM8L101F2 数据表(HTML) 70 Page - STMicroelectronics |
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70 / 77 page ![]() Package characteristics STM8L101xx 70/77 Doc ID 15275 Rev 7 Figure 45. TSSOP20 - 20-lead thin shrink small package outline (1) Figure 46. TSSOP20 recommended footprint (1)(2) 1. Drawing is not to scale 2. Dimensions are in millimeters TSSOP20-M 1 20 CP c L E E1 D A2 A α e b 10 11 A1 L1 Table 43. 20-lead thin shrink small package, mechanical data Dim. mm inches(1) Min Typ Max Min Typ Max A 1.2 0.0472 A1 0.05 0.15 0.002 0.0059 A2 0.8 1 1.05 0.0315 0.0394 0.0413 b 0.19 0.3 0.0075 0.0118 CP 0.1 0.0039 c 0.09 0.2 0.0035 0.0079 D 6.4 6.5 6.6 0.252 0.2559 0.2598 E 6.2 6.4 6.6 0.2441 0.252 0.2598 E1 4.3 4.4 4.5 0.1693 0.1732 0.1772 e - 0.65 - 0.1693 0.0256 - L 0.45 0.6 0.75 0.1693 0.0236 0.0295 L1 1 0.0394 a0° 8° 0° 8° Number of pins N20 1. Values in inches are converted from mm and rounded to 4 decimal digits. |
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