MCP621 datasheet(22/44 Pages) MICROCHIP

22 / 44 page

MCP621/2/5

DS22188A-page 22

When the VCAL pin is driven by an external voltage

source, which is within its specified range, the op amp

will have its input offset voltage calibrated at that

common mode input voltage. Make sure that VCAL is

within its specified range.

It is possible to use an external resistor voltage divider

to modify VCM_INT; see Figure 4-2. The internal circuitry

at the VCAL pin looks like 100 kΩ tied to VDD/3. The

parallel equivalent of R1 and R2 should be much

smaller than 100 k

Ω to minimize differences in match-

ing and temperature drift between the internal and

external resistors. Again, make sure that VCAL is within

its specified range.

FIGURE 4-2:

Setting VCM with External

Resistors.

For instance, a design goal to set VCM_INT =0.1V when

VDD = 2.5V could be met with: R1 =24.3kΩ,

R2 =1.00 kΩ and C1 = 100 nF. This will keep VCAL

within its range for any VDD, and should be close

enough to 0V for ground based applications.

4.2

Input

4.2.1

PHASE REVERSAL

The input devices are designed to not exhibit phase

inversion when the input pins exceed the supply

voltages.

Figure 2-41

shows

input

voltage

exceeding both supplies with no phase inversion.

4.2.2

INPUT VOLTAGE AND CURRENT

LIMITS

The ESD protection on the inputs can be depicted as

shown in Figure 4-3. This structure was chosen to

protect the input transistors, and to minimize input bias

current (IB). The input ESD diodes clamp the inputs

when they try to go more than one diode drop below

VSS. They also clamp any voltages that go too far

above VDD; their breakdown voltage is high enough to

allow normal operation, and low enough to bypass

quick ESD events within the specified limits.

FIGURE 4-3:

Simplified Analog Input ESD

Structures.

In order to prevent damage and/or improper operation

of these amplifiers, the circuit must limit the currents

(and voltages) at the input pins (see Section 1.1

“Absolute Maximum Ratings †”). Figure 4-4 shows

the recommended approach to protecting these inputs.

The internal ESD diodes prevent the input pins (VIN+

and VIN–) from going too far below ground, and the

resistors R1 and R2 limit the possible current drawn out

of the input pins. Diodes D1 and D2 prevent the input

pins (VIN+ and VIN–) from going too far above VDD, and

dump any currents onto VDD. When implemented as

shown, resistors R1 and R2 also limit the current

through D1 and D2.

FIGURE 4-4:

Protecting the Analog

Inputs.

It is also possible to connect the diodes to the left of the

resistor R1 and R2. In this case, the currents through

the diodes D1 and D2 need to be limited by some other

mechanism. The resistors then serve as in-rush current

limiters; the DC current into the input pins (VIN+ and

VIN–) should be very small.

A significant amount of current can flow out of the

inputs (through the ESD diodes) when the common

mode voltage (VCM) is below ground (VSS); see

Figure 2-15. Applications that are high impedance may

need to limit the usable voltage range.

VSS

VDD

VCAL

MCP62X

Bond

Pad

Bond

Pad

Bond

Pad

VDD

VIN+

VSS

Input

Stage

Bond

Pad

VIN–

VDD

R1 >

VSS – (minimum expected V1)

2mA

VOUT

R2 >

VSS – (minimum expected V2)

2mA

MCP62X

MCP621 数据表(PDF) 22 Page - Microchip Technology

MCP621 数据表(HTML) 22 Page - Microchip Technology

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44

数据表下载

链接网址

MCP621 数据表(PDF) 22 Page - Microchip Technology

MCP621 数据表(HTML) 22 Page - Microchip Technology

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44

数据表 下载

链接网址

数据表下载