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MCP621 数据表(PDF) 31 Page - Microchip Technology |
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MCP621 数据表(HTML) 31 Page - Microchip Technology |
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31 / 44 page ![]() © 2009 Microchip Technology Inc. DS22188A-page 31 MCP621/2/5 6.0 PACKAGING INFORMATION 6.1 Package Marking Information Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 8-Lead SOIC (150 mil) (MCP621, MCP622) Example : XXXXXXXX XXXXYYWW NNN MCP621E SN 0921 256 3 e 8-Lead DFN (3x3) (MCP622) Example: XXXX YYWW NNN DABL 0921 256 Device Code MCP622 DABL Note: Applies to 8-Lead 3x3 DFN 10-Lead DFN (3x3) (MCP625) 10-Lead MSOP (MCP625) Example: XXXXXX YWWNNN 625EUN 921256 Example: XXXX YYWW NNN BAFA 0921 256 Device Code MCP625 BAFA Note: Applies to 10-Lead 3x3 DFN |
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