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Revision 1.33

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AS1100

Data Sheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Notes

-0.3

+6

V

DIN, CLK, LOAD to GND

-0.3

+6

V

All other Pins to GND

-0.3

V

-0.3

7

V

Electro Static Discharge at Digital

Outputs

+500

V

Electro Static Discharge at all other pins

+1000

V

Current

DIG0–DIG7 Sink Current

500

mA

SEGA–G, DP Source Current

100

mA

Latch up Immunity

±200

mA

Continuous Power Dissipation (TA = +85°C)

Narrow Plastic DIP

1066

mW

Derate 13.3mW/°C above +70°C

Wide SO

941

mW

Derate 11.8mW/°C above +70°C

AS1100xL

0

+70

ºC

AS1100xE

-40

+85

ºC

Storage Temperature Range

-65

+150

ºC

Package Body Temperature

+260

ºC

The reflow peak soldering temperature

(body temperature) specified is in

accordance with IPC/JEDEC J-STD-

020C “Moisture/Reflow Sensitivity

Classification for Non-Hermetic Solid

State Surface Mount Devices”.

The lead finish for Pb-free leaded

packages is matte tin (100% Sn).