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AS1530/AS1531

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Electrical Character-

istics on page 5 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

-0.3

+7

V

-0.3

+0.3

V

CH0:CH7, COM to GND

-0.3

+0.3

V

REF, REFADJ to GND

-0.3

+0.3

V

DIN, SCLK, CSN, to GND

-0.3

+0.3

V

DOUT, SSTRB to GND

-0.3

+0.3

V

DOUT, SSTRB Sink Current

25

mA

Continuous Power Dissipation

559

mW

Derate 7.0mW/ºC above +70ºC

Operating Temperature Range

-40

+85

ºC

Storage Temperature Range

-60

+150

ºC

Package Body Temperature

+260

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with

IPC/JEDEC J-STD-020C “Moisture/Reflow

Sensitivity Classification for Non-Hermetic

Solid State Surface Mount Devices”.

The lead finish for Pb-free leaded packages is

matte tin (100% Sn).