www.austriamicrosystems.com/AS3932

Revision 1.2

30 - 33

AS3932

Note:

1. Die thickness allowable is 0.279 ± 0.0127.

2. Dimensioning and tolerances conform to ASME Y14.5M-1994.

3. Datum plane H located at mold parting line and coincident with lead, where lead exits plastic body at bottom of parting line.

4. Datum A-B and D to BE determined where center line between leads exits plastic body at datum plane H.

5. D & E1 are reference datum and do not include mold flash or protrusions, and are measured at the bottom parting line. Mold lash or pro-

trusions shall not exceed 0.15mm on D and 0.25mm on E per side.

6. Dimension is the length of terminal for soldering to a substrate.

7. Terminal positions are shown for reference only.

8. Formed leads shall be planar with respect to one another within 0.076mm at seating plane.

9. The lead width dimension does not include dambar protrusion. Allowable dambar protrusion shall be 0.07mm total in excess of the lead

width dimension at maximum material condition. Dambar cannot be located on the lower radius or the foot. Minimum space between

protrusions and an adjacent lead should be 0.07mm for 0.65mm pitch.

10. Section B-B to be determined at 0.10mm to 0.25mm from the lead tip.

11. Dimensions P and P1 are thermally enhanced variations. Values shown are maximum size of exposed pad within lead count and body

size. End user should verify available size of exposed pad for specific device application.

12. All dimensions are in millimeters, angle is in degrees.

13. N is the total number of terminals.