Production Data

WM8141

WOLFSON MICROELECTRONICS LTD

PD Rev 3.0 October 2000

3

PIN

NAME

TYPE

DESCRIPTION

Serial Interface: Enable pulse, active high.

Parallel Interface: Strobe, active low.

23

SEN/STB

Digital input

Latched on NRESET rising edge: If Low then device control is via serial interface,

if High then device control is via parallel interface.

24

SDI/DNA

Digital input

Serial Interface: Serial input

data signal.

Parallel Interface: High = data,

Low = address.

25

SCK/RNW

Digital input

Serial Interface: Serial clock signal.

Parallel Interface:

High = OP[11:4] is output bus,

Low = OP[11:4] is input bus (Hi-Z)

26

RLC/

ACYC

Digital input

Selects whether Reset Level Clamp is

applied (active high). If RLC is required on

every pixel then this pin can be tied high.

ACYC, auto-cycles between RINP, GINP,

BINP when in line by line mode.

27

VSMP

Digital input

Video sample synchronisation pulse.

28

MCLK

Digital input

Master clock. This clock is applied at N times the input pixel rate (N = 8, 6, 3 or 2

depending on the input sampling mode).

29

DGND

Supply

Digital ground (0V).

30

OP[0]

Digital output

31

OP[1]

Digital output

Hi-Z digital 12-bit bi-directional bus, see description for pins OP[2] to OP[11]/SDO.

32

DVDD2

Supply

Digital supply (3.3/5V) for all digital pins.

ABSOLUTE MAXIMUM RATINGS

Absolute Maximum Ratings are stress ratings only. Permanent damage to the device may be caused by continuously operating at

or beyond these limits. Device functional operating limits and guaranteed performance specifications are given under Electrical

Characteristics at the test conditions specified

ESD Sensitive Device. This device is manufactured on a CMOS process. It is therefore generically susceptible

to damage from excessive static voltages. Proper ESD precautions must be taken during handling and storage

of this device.

As per JEDEC specifications A112-A and A113-B, this product requires specific storage conditions prior to surface mount

assembly. It has been classified as having a Moisture Sensitivity Level of 2 and as such will be supplied in vacuum-sealed

moisture barrier bags.

CONDITION

MIN

MAX

Analogue supply voltage: AVDD

GND - 0.3V

GND + 7V

Digital supply voltages: DVDD1, DVDD2

GND - 0.3V

GND + 7V

Digital ground: DGND

GND - 0.3V

GND + 0.3V

Analogue ground: AGND

GND - 0.3V

GND + 0.3V

Digital inputs, digital outputs and digital pins

GND - 0.3V

DVDD2 + 0.3V

Analogue inputs (RINP, GINP, BINP)

GND - 0.3V

AVDD + 0.3V

Other pins

GND - 0.3V

AVDD + 0.3V

0

°C+70°C

Storage temperature

-50

°C

+150

°C

Package body temperature (soldering, 10 seconds)

+240

°C

Package body temperature (soldering, 2 minutes)

+183

°C

Notes: 1.

GND denotes the voltage of any ground pin.

2.

AGND and DGND pins are intended to be operated at the same potential. Differential voltages between these pins

will degrade performance.

3.

AVDD and DVDD1 pins are intended to be operated at the same potential. Differential voltages between these pins

will degrade performance.