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PCF8564AU/5GE/1 数据表(PDF) 31 Page - NXP Semiconductors |
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PCF8564AU/5GE/1 数据表(HTML) 31 Page - NXP Semiconductors |
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31 / 44 page ![]() PCF8564A_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 1 — 8 October 2009 31 of 44 NXP Semiconductors PCF8564A Real time clock and calendar 16. Bare die outline Fig 27. Bare die outline of PCF8564AU References Outline version European projection Issue date IEC JEDEC JEITA PCF8564AU pcf8564au_do 09-08-25 09-09-10 Unit mm max nom min 0.2 1.26 1.05 0.22 0.9 0.1 0.1 0.09 A(3) Dimensions Die type 2 Note 1. Chip dimensions including sawline. 2. Marking code: PC8564A-1 3. Dimension depending on delivery form Wire bond die; 9 bonding pads PCF8564AU D(1) E(1) 1.89 ee1 e2 P1 P2 0.09 P3 P4 Unit mm max nom min 0.2 1.27 1.05 0.22 0.9 0.1 0.1 0.09 A(3) Dimensions Die type 1 D(1) E(1) 1.9 ee1 e2 P1 P2 0.09 P3 P4 0 0.5 1 mm scale A detail X P2 P1 P4 P3 e2 e1 e X (2) y 0,0 x D E |
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