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ADT7320UCPZ-R2 数据表(PDF) 6 Page - Analog Devices

部件名 ADT7320UCPZ-R2
功能描述  짹0.25째C Accurate, 16-Bit Digital SPI Temperature Sensor
PDF  24 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADT7320UCPZ-R2 数据表(HTML) 6 Page - Analog Devices

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ADT7320
Preliminary Technical Data
Rev. PrA | Page 6 of 24
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
12
11
10
1
3
4
VDD
GND
CT
9 INT
SCLK
DIN
2
DOUT
CS
ADT7320
TOP VIEW
(Not to Scale)
NOTES
1. NC = NO CONNECT.
2. THE EXPOSED PADDLE IS CONNECTED INTERNALLY.
FOR INCREASED RELIABILITY OF THE SOLDER
JOINTS AND MAXIMUM THERMAL CAPABILITY, IT IS
RECOMMENDED THAT THE PAD BE SOLDERED TO
THE GROUND PLANE.
Figure 3. Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
Mnemonic
Description
1
SCLK
Serial Clock Input. The serial clock is used to clock in and clock out data to and from any register of the
ADT7320.
2
DOUT
Serial Data Output. Data is clocked out on the SCLK falling edge and is valid on the SCLK rising edge.
3
DIN
Serial Data Input. Serial data to be loaded to the control registers of the part is provided on this input. Data
is clocked into the registers on the rising edge of SCLK.
4
CS
Chip Select Input. The device is selected when this input is low. The device is disabled when this pin is high.
5
NC
No Connect.
6
NC
No Connect.
7
NC
No Connect.
8
NC
No Connect.
9
INT
Overtemperature and Undertemperature Indicator. Logic output. Power-up default setting is as an active
low comparator interrupt. Open-drain configuration. A pull-up resistor is required, typically 10 kΩ.
10
CT
Critical Overtemperature Indicator. Logic output. Power-up default polarity is active low. Open-drain
configuration. A pull-up resistor is required, typically 10 kΩ.
11
GND
Analog and Digital Ground.
12
VDD
Positive Supply Voltage (2.7 V to 5.5 V). The supply should be decoupled with a 0.1 μF ceramic capacitor to
ground.
13
NC
No Connect.
14
NC
No Connect.
15
NC
No Connect.
16
NC
No Connect.
EPAD
The exposed paddle is connected internally. For increased reliability of the solder joints and maximum
thermal capability, it is recommended that the pad be soldered to the ground plane.



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