MCP2003 datasheet(1/32 Pages) MICROCHIP

部件名	MCP2003

功能描述	LIN J2602 Transceiver

PDF	32 Pages

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制造商	MICROCHIP [Microchip Technology]

网页	http://www.microchip.com

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 2010 Microchip Technology Inc.

DS22230A-page 1

MCP2003/4

Features

• The MCP2003 and MCP2004 are compliant with

LIN Bus Specifications 1.3, 2.0 and 2.1 and are

compliant to SAE J2602

• Support Baud Rates up to 20 Kbaud

with

LIN-compatible output driver

• 43V load dump protected

• Very low EMI meets stringent OEM requirements

• Very high ESD immunity:

- >20kV on VBB (IEC 61000-4-2)

- >14kV on LBUS (IEC 61000-4-2)

• Very high immunity to RF disturbances meets

stringent OEM requirements

• Wide supply voltage, 6.0V-27.0V continuous

• Extended Temperature Range: -40 to +125°C

• Interface to PIC® MCU EUSART and standard

USARTs

• Local Interconnect Network (LIN) bus pin:

- Internal pull-up resistor and diode

- Protected against battery shorts

- Protected against loss of ground

- High current drive

• Automatic thermal shutdown

• Low-power mode:

- Receiver monitoring bus and transmitter off,

(

 5µA)

Description

This device provides a bidirectional, half-duplex

communication physical interface to automotive and

industrial LIN systems to meet the LIN bus specification

Revision 2.1 and SAE J2602. The device is short circuit

and overtemperature protected by internal circuitry.

The device has been specifically designed to operate in

the automotive operating environment and will survive

all specified transient conditions while meeting all of the

stringent quiescent current requirements.

MCP200X family members:

• 8-pin PDIP, DFN and SOIC packages:

- MCP2003, LIN-compatible driver, with WAKE

pins

- MCP2004, LIN-compatible driver, with

FAULT/TXE pins

Package Types

MCP2004

PDIP, SOIC

FAULT/TXE

CS

TXD

VBB

LBUS

1

2

3

4

8

7

6

5 VSS

VREN

RXD

MCP2003

PDIP, SOIC

WAKE

CS

TXD

VBB

LBUS

1

2

3

4

8

7

6

5 VSS

VREN

RXD

MCP2003

4x4 DFN*

WAKE

CS

TXD

VBB

LBUS

1

2

3

4

8

7

6

5 VSS

VREN

RXD

EP

9

MCP2004

4x4 DFN*

FAULT/TXE

CS

TXD

VBB

LBUS

1

2

3

4

8

7

6

5 VSS

VREN

RXD

EP

9

* Includes Exposed Thermal Pad (EP); see Table 1-1.

LIN J2602 Transceiver

类似零件编号 - MCP2003

制造商	部件名	数据表	功能描述
Microchip Technology	MCP2003	918Kb / 34P	LIN J2602 Transceiver 11/29/11
	MCP2003-E/MD	581Kb / 34P	LIN J2602 Transceiver 03/25/14
	MCP2003-E/P	581Kb / 34P	LIN J2602 Transceiver 03/25/14
	MCP2003-E/SN	581Kb / 34P	LIN J2602 Transceiver 03/25/14
	MCP2003A	918Kb / 34P	LIN J2602 Transceiver 11/29/11

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类似说明 - MCP2003

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ATMEL Corporation	ATA6661	209Kb / 15P	LIN TRANSCEIVER
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Micon Design Technology...	PIC16F1829LIN	1Mb / 74P	20-Pin, 8-bit Flash LIN/J2602 Microcontroller
Microchip Technology	MCP2003	918Kb / 34P	LIN J2602 Transceiver 11/29/11
Microchip Technology	MCP2003	581Kb / 34P	LIN J2602 Transceiver 03/25/14
Infineon Technologies A...	TLE7268	701Kb / 34P	Dual LIN 2.2 / SAE J2602 Transceiver Rev. 1.0 2017-09-14
NXP Semiconductors	TJA1027	650Kb / 24P	ISO 17987/LIN 2.x/SAE J2602 transceiver Rev. 3-18 December 2018