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MCP2003 数据表(PDF) 19 Page - Microchip Technology |
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MCP2003 数据表(HTML) 19 Page - Microchip Technology |
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19 / 32 page  2010 Microchip Technology Inc. DS22230A-page 19 MCP2003/4 3.0 PACKAGING INFORMATION 3.1 Package Marking Information XXXXXXXX XXXXXNNN YYWW 8-Lead PDIP (300 mil) Example: 8-Lead SOIC (150 mil) Example: XXXXXXXX XXXXYYWW NNN E/P^^256 0948 MCP2003E SN^^0948 256 MCP2003 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 3 e 3 e 8-Lead DFN (4x4) Example : XXXXXX YYWW NNN XXXXXX 2004 0948 256 E/MD^^ 3 e |
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