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STM6513 数据表(PDF) 22 Page - STMicroelectronics |
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STM6513 数据表(HTML) 22 Page - STMicroelectronics |
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22 / 29 page ![]() Package footprint STM6513 22/29 Doc ID 16490 Rev 2 9 Package footprint Figure 14. Landing pattern - TDFN – 8-lead 2 x 2 mm without thermal pad Table 8. Parameter for landing pattern - TDFN – 8-lead 2 x 2 mm package Parameter Description Dimension (mm) Min. Nom. Max. L Contact length 1.05 — 1.15 b Contact width 0.25 — 0.30 E Max. land pattern Y-direction — 2.85 — E1 Contact gap spacing — 0.65 — D Max. land pattern X-direction — 1.75 — P Contact pitch — 0.5 — AM00441 D P E1 E L b |
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