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M95320 数据表(PDF) 42 Page - STMicroelectronics |
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M95320 数据表(HTML) 42 Page - STMicroelectronics |
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42 / 44 page ![]() Revision history M95320, M95320-W, M95320-R 42/44 Doc ID 5711 Rev 12 07-Jul-2006 6 Document converted to new ST template. Packages are ECOPACK® compliant. PDIP package removed. SO8N package specifications updated (see Table 21 and Figure 18). M95640-S and M95320-S part numbers removed (DC and AC parameters updated accordingly). How to identify previous, current and new products by the Process identification letter Table removed. Figure 4: SPI modes supported updated and Note 2 added. First three paragraphs of Section 4: Operating features replaced by Section 4.1: Supply voltage (VCC). TA added to Table 7: Absolute maximum ratings. ICC and ICC1 updated in Table 13, Table 13, Table 14 and Table 16. VOL and VOH updated in Table 14. ICC updated in Table 15. Data in Table 16 is no longer preliminary. tCH updated in Table 18. Table 21: AC characteristics (M95640-R) added. Timing line of tSHQZ modified in Figure 17: Serial output timing. Process letter added to Table 24: Ordering information scheme, Note 2 removed. Note 2 removed from Figure 2. 09-Oct-2007 7 JEDEC standard revision updated to D in Note 1 below Table 7: Absolute maximum ratings. Note 2 removed below Figure 3 and explanatory paragraph added. Section 4.1: Supply voltage (VCC) updated. Table 6: Address range bits corrected. Products operating at VCC = 4.5 V to 5.5 V are no longer available in the device grade 6 TA temperature range. ICC and ICC1 parameters modified in Table 14: DC characteristics (M95320-W, device grade 6). Maximum frequency for M95320-W and M95640-W upgraded from 5 MHz to 10 MHz in the device grade 6 TA temperature range (Table 18: AC characteristics (M95320-W, device grade 6) modified accordingly). Table 27: Available M95640x products (package, voltage range, temperature grade): /PB process letter added, /P process letter removed. Blank option removed below Plating technology in Table 24: Ordering information scheme. Table 25 and Table 27 added. Small text changes. Table 23: UFDFPN8 (MLP8) - 8-lead ultra thin fine pitch dual flat no lead, package mechanical data updated. Package mechanical inch values calculated from mm and rounded to 4 decimal digits in Section 10: Package mechanical data. 17-Dec-2007 8 Section 2.7: VSS ground added. Device behavior when VCC passes over the POR threshold updated (see Section 4.1.2: Device reset and Section 4.1.4: Power-down). VIL and VIH modified in Table 16: DC characteristics (M95320-R). tW, write time, modified in Table 20: AC characteristics (M95320-R) and Table 21: AC characteristics (M95640-R). Small text changes. Table 26. Document revision history (continued) Date Revision Changes |
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