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ADN2526ACPZ-R2 数据表(PDF) 7 Page - Analog Devices |
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ADN2526ACPZ-R2 数据表(HTML) 7 Page - Analog Devices |
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7 / 16 page ![]() ADN2526 Rev. A | Page 7 of 16 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS PIN 1 INDICATOR 1 MSET 2 CPA 3 ALS 4 VEE 11 IBMON 12 BSET 10 IBIAS 9VEE TOP VIEW (Not to Scale) ADN2526 NOTES 1. THE EXPOSED PAD ON THE BOTTOM OF THE PACKAGE MUST BE CONNECTED TO VCC OR THE GND PLANE. Figure 4. Pin Configuration Table 4. Pin Function Descriptions Pin No. Mnemonic I/O1 Description 1 MSET AI Modulation Current Control Input. 2 CPA AI Adjustable Cross Point. Defaults to not connected (NC) mode (floating). 3 ALS DI Automatic Laser Shutdown. 4 VEE P Negative Power Supply. Normally connected to system ground. 5 VCC P Positive Power Supply. 6 IMODN AI Modulation Current Sink, Negative. 7 IMODP AI Modulation Current Sink, Positive. 8 VCC P Positive Power Supply. 9 VEE P Negative Power Supply. Normally connected to system ground. 10 IBIAS AI Bias Current Sink. 11 IBMON AO Bias Current Monitoring Output. 12 BSET AI Bias Current Control Input. 13 VCC P Positive Power Supply. 14 DATAP AI Data Signal Positive Input. 15 DATAN AI Data Signal Negative Input. 16 VCC P Positive Power Supply. 17 (EPAD) Exposed Pad (EPAD) P The exposed pad on the bottom of the package must be connected to VCC or the GND plane. 1 AI = analog input, DI = digital input, P = power, AO = analog output. |
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