| 数据搜索系统,热门电子元器件搜索 |
|
AD7468BRT-R 数据表(PDF) 25 Page - Analog Devices |
|
|
|||||||||||||||||||||||||||||
AD7468BRT-R 数据表(HTML) 25 Page - Analog Devices |
|
25 / 28 page ![]() AD7466/AD7467/AD7468 Rev. C | Page 25 of 28 APPLICATION HINTS GROUNDING AND LAYOUT The printed circuit board that houses the AD7466/AD7467/ AD7468 should be designed such that the analog and digital sections are separated and confined to certain areas. This facili- tates the use of ground planes that can be separated easily. A minimum etch technique is generally best for ground planes because it gives the best shielding. Digital and analog ground planes should be joined at only one place. If the devices are in a system where multiple devices require an AGND to DGND connection, the connection should still be made at one point only, a star ground point, which should be established as close as possible to the AD7466/AD7467/AD7468. Avoid running digital lines under the device because these couple noise onto the die. The analog ground plane should be allowed to run under the AD7466/AD7467/AD7468 to avoid noise coupling. The power supply lines to the devices should use as large a trace as possible to provide low impedance paths and to reduce the effects of glitches on the power-supply line. Fast switching signals, like clocks, should be shielded with digital ground to avoid radiating noise to other sections of the board, and clock signals should never be run near the analog inputs. Avoid crossover of digital and analog signals. Traces on opposite sides of the board should run at right angles to each other to reduce the effects of feedthrough on the board. A microstrip technique is the best choice, but is not always possible with a double-sided board. With this technique, the component side of the board is dedicated to ground planes, while signals are placed on the solder side. Good decoupling is also very important. All analog supplies should be decoupled with 10 μF tantalum in parallel with 0.1 μF capacitors to AGND. All digital supplies should have a 0.1 μF ceramic disc capacitor to DGND. To achieve the best perform- ance from these decoupling components, the user should keep the distance between the decoupling capacitor and the VDD and GND pins to a minimum, with short track lengths connecting the respective pins. EVALUATING THE PERFORMANCE OF THE AD7466 AND AD7467 The evaluation board package includes a fully assembled and tested evaluation board, documentation, and software for controlling the board from the PC via an evaluation board controller. To evaluate the ac and dc performance of the AD7466 and AD7467, the evaluation board controller can be used in conjunction with the AD7466/AD7467CB evaluation board and other Analog Devices evaluation boards ending in the CB designator. The software allows the user to perform ac tests (fast Fourier transform) and dc tests (histogram of codes) on the AD7466 and AD7467. See the data sheet in the evaluation board package for more information. |
|
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |