MICRF219 datasheet(20/23 Pages) MICREL

20 / 23 page

Micrel

MICRF219

June 2011

M9999-060811

(408) 944-0800

nloa

ning

s as

g ne

ger

) lon

uld al

be done with exhaustive range tests. Make sure the

individual ground connection has a dedicated via

rather then sharing a few of ground points by a single

via. Sharing ground via will increase the ground path

ld be solid and with no

g ground plane on top

ents. It normally adds

which changes the

materials as they are

ically, FR4 or better

he RF path should be

avoid loops and

ground and VDD lines

wer circuits (such

own sources of noise should

be laid out as far as possible from the RF circuits.

Avoid unnecessary wide traces which would add more

distribution capacitance (between top trace to bottom

GND plane) and alter the RF parameters.

PCB Considerations and Layou

Figure 19 to Figure 23 show the QR219BPF PCB

layout. The Gerber files provided are dow

dable

from Micrel Website and contain the remai

layers

needed to fabricate this board. When copying or

making one’s own boards, make the trace

short

as possible. Long traces alter the matchin

twork

and the values suggested are no lon

valid.

Suggested matching values may vary due to PCB

variations. A PCB trace 100 mills (2.5mm

g has

about 1.1nH inductance. Optimization sho

ways

inductance. Ground plane shou

sudden interruptions. Avoid usin

layer next to the matching elem

additional stray capacitance

matching. Do not use Phenolic

conductive above 200MHz. Typ

materials are recommended. T

as straight as possible to

unnecessary turns. Separate

from other digital or switching po

microcontroller…etc). Kn

Figure 19. QR219BPF Top Layer

Figure 20. QR219BPF Bottom Layer

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