ADP1614

Data Sheet

Rev. 0 | Page 4 of 16

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VIN, EN, FB to GND

−0.3 V to +6 V

CLRES to GND

−0.3 V to VIN

COMP to GND

1.0 V to 1.6 V

SS to GND

−0.3 V to +1.3 V

SW to GND

21 V

Operating Junction Temperature Range

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Soldering Conditions

JEDEC J-STD-020

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Absolute maximum ratings apply individually only, not in

combination.

THERMAL RESISTANCE

is specified for the worst-case conditions, that is, a device soldered

dependent on the application and board layout. In applications

where high maximum power dissipation exists, attention to

depending on the printed circuit board (PCB) material, layout,

and environmental conditions.

The boundary conditions for the thermal resistance of the

ADP1614 are modeled under natural convection cooling at

25°C ambient temperature, JESD 51-9, and 1 W power input on a

4-layer board.

Table 3. Thermal Resistance1

Package Type

Unit

10-Lead LFCSP

47

7.22

°C/W

1

Thermal numbers per JEDEC standard JESD 51-9.

ESD CAUTION