Data Sheet

ADP1614

Rev. 0 | Page 15 of 16

PCB LAYOUT GUIDELINES

For high efficiency, good regulation, and stability, a well designed

PCB layout is required.

Use the following guidelines when designing PCBs (see Figure 25

for a block diagram and Figure 2 for a pin configuration).

•

C4 in Figure 28, close to VIN and GND. This minimizes

noise injected into the part from board parasitic inductance.

•

to SW and GND as short as possible.

•

Keep the high current path from VIN through the inductor

which is labeled as C7 in Figure 28, as short as possible.

•

Keep high current traces as short and as wide as possible.

•

Place the feedback resistors as close to FB as possible to

prevent noise pickup. Connect the ground of the feedback

network directly to an AGND plane that makes a Kelvin

connection to the GND pin.

•

Place the compensation components as close as possible to

COMP. Connect the ground of the compensation network

directly to an AGND plane that makes a Kelvin connection

to the GND pin.

•

C1 in Figure 28, as close as possible to the device. Connect

the ground of the soft start capacitor to an AGND plane

that makes a Kelvin connection to the GND pin.

•

labeled as R4 in Figure 28, as close as possible to the device.

Connect the ground of the CL resistor to an AGND plane

that makes a Kelvin connection to the GND pin.

•

The PCB must be properly designed to conduct the heat

away from the package. This is achieved by adding thermal

vias to the PCB, which provide a thermal path to the inner

or bottom layers. Thermal vias should be placed on the

PCB underneath the exposed pad of the LFCSP and in the

GND plane around the ADP1614 package to improve

thermal performance of the package.

Avoid routing high impedance traces from the compensation

and feedback resistors near any node connected to SW or near

the inductor to prevent radiated noise injection.

Figure 28. ADP1614 Recommended Top Layer Layout for Boost Application

Figure 29. ADP1614 Recommended Bottom Layer Layout for Boost Application