AS8221

Datasheet - Absolute Maximum Rat i ngs

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Revision 1.7

6 - 42

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only. Functional operation of the

device at these or any other conditions beyond those indicated in Electrical Characteristics on page 7 is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Notes

-0.3

+50

V

-0.3

+7.0

V

-0.3

+7.0

V

DC Voltage at EN, STBN, ERRN, TxD, RxD,

TxEN, BGE, RxEN

-0.3

V

DC Voltage on pin WAKE, INH1, INH2

-0.3

DC Voltage at BP and BM

-40

+50

V

Input current (latchup immunity)

-100

100

mA

According to JEDEC 78

±4

kV

AEC-Q100-002 (HBM)

±2

kV

All other pins according to AEC-Q100-002 (HBM)

±3

kV

BP and BM according to FlexRay Physical Layer

EMC Measurement Specification Version 3.0

±500

V

On all pins

AEC-Q100-011 (Charge Device Model)

±750

V

Corner pins

AEC-Q100-011 (Charge Device Model)

±100

V

AEC-Q100-003 (Machine Model)

Transient voltage on BP, BM

-200

+200

V

According to ISO7637 part3 test pulses a and b;

class C; RL=45

, CL= 100 pF;

(see Figure 18 on page 30).

-200

+200

V

According to ISO7637 part2 test pulses 1, 2, 3a

and 3b; class C; RL=45

, CL= 100pF;

(see Figure 18 on page 30).

+6.5

+50

V

According to ISO7637 part2 test pulse 4; class C;

RL=45

, CL= 100pF;

(see Figure 18 on page 30).

+50

According to ISO7637 part2 test pulse 5b;

class C; RL=45

, CL= 100pF;

(see Figure 18 on page 30).

Total power dissipation (all supplies and outputs)

150

mW

Storage temperature

-55

+150

ºC

Junction temperature

-40

+150

ºC

Package body temperature

260

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with IPC/

JEDEC J-STD-020 “Moisture/Reflow Sensitivity

Classification for Non-Hermetic Solid State

Surface Mount Devices”.

The lead finish for Pb-free leaded packages is

matte tin (100% Sn).

Humidity non-condensing

5

85

%

Moisture Sensitivity Level

3

Represents a maximum floor life time of 168h