WM8946ECSSLASHR datasheet(173/175 Pages) WOLFSON

173 / 175 page

Production Data

WM8946

PD, July 2012, Rev 4.3

173

PACKAGE DIMENSIONS

B: 36 BALL W-CSP PACKAGE 2.970 X 3.070 X 0.7mm BODY, 0.50 mm BALL PITCH

CORNER

TOP VIEW

DETAIL 2

bbb

DETAIL 1

BOTTOM VIEW

NOTES:

1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.

2. THIS DIMENSION INCLUDES STAND-OFF HEIGHT ‘A1’ AND BACKSIDE COATING.

3. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE.

4. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY.

5. ‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH.

6. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.

7. FOLLOWS JEDEC DESIGN GUIDE MO-211-C.

0.207

2.500 BSC

3.070

0.223

2.500 BSC

0.500 BSC

2.970

Dimensions (mm)

Symbols

MIN

NOM

MAX

NOTE

0.700

0.418

0.434

0.450

0.740

0.660

0.244

0.281

0.022

0.314

0.273

DM063.B

2.945

2.995

3.045

3.095

0.264

0.364

aaa

2 X

aaa

2 X

ddd M

A B

ccc

aaa

bbb

ccc

ddd

0.025

0.060

0.030

0.015

WM8946ECS/R 数据表(PDF) 173 Page - Wolfson Microelectronics plc

WM8946ECS/R 数据表(HTML) 173 Page - Wolfson Microelectronics plc

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

数据表下载