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MMDF2C02HD 数据表(PDF) 2 Page - Motorola, Inc |
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MMDF2C02HD 数据表(HTML) 2 Page - Motorola, Inc |
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2 / 12 page ![]() MMDF2C02HD 2 Motorola TMOS Power MOSFET Transistor Device Data ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)(1) Characteristic Symbol Polarity Min Typ Max Unit OFF CHARACTERISTICS Drain–Source Breakdown Voltage (VGS = 0 Vdc, ID = 250 µAdc) V(BR)DSS — 20 — — Vdc Zero Gate Voltage Drain Current (VDS = 20 Vdc, VGS = 0 Vdc) IDSS (N) (P) — — — — 1.0 1.0 µAdc Gate–Body Leakage Current (VGS = ± 20 Vdc, VDS = 0) IGSS — — — 100 nAdc ON CHARACTERISTICS(2) Gate Threshold Voltage (VDS = VGS, ID = 250 µAdc) VGS(th) — 1.0 1.5 2.0 Vdc Drain–to–Source On–Resistance (VGS = 4.5 Vdc, ID = 1.5 Adc) (VGS = 4.5 Vdc, ID = 1.0 Adc) RDS(on) (N) (P) — — 0.074 0.152 0.100 0.180 Ohm Drain–to–Source On–Resistance (VGS = 10 Vdc, ID = 3.0 Adc) (VGS = 10 Vdc, ID = 2.0 Adc) RDS(on) (N) (P) — — 0.058 0.118 0.090 0.160 Ohm Forward Transconductance (VDS = 3.0 Vdc, ID = 1.5 Adc) (VDS = 3.0 Vdc, ID = 1.0 Adc) gFS (N) (P) 2.0 2.0 3.88 3.0 — — mhos DYNAMIC CHARACTERISTICS Input Capacitance (VDS = 16 Vdc, VGS = 0 Vdc, f = 1.0 MHz) Ciss (N) (P) — — 455 420 630 588 pF Output Capacitance (VDS = 16 Vdc, VGS = 0 Vdc, f = 1.0 MHz) Coss (N) (P) — — 184 290 250 406 Transfer Capacitance Crss (N) (P) — — 45 116 90 232 SWITCHING CHARACTERISTICS(3) Turn–On Delay Time (VDD = 10 Vdc, ID = 3.0 Adc, VGS = 4.5 Vdc, RG = 6.0 Ω) (VDD = 10 Vdc, ID = 2.0 Adc, VGS = 4.5 Vdc, RG = 6.0 Ω) td(on) (N) (P) — — 11 19 22 38 ns Rise Time (VDD = 10 Vdc, ID = 3.0 Adc, VGS = 4.5 Vdc, RG = 6.0 Ω) (VDD = 10 Vdc, ID = 2.0 Adc, VGS = 4.5 Vdc, RG = 6.0 Ω) tr (N) (P) — — 58 66 116 132 Turn–Off Delay Time (VDD = 10 Vdc, ID = 2.0 Adc, VGS = 4.5 Vdc, RG = 6.0 Ω) td(off) (N) (P) — — 17 25 35 50 Fall Time VGS = 4.5 Vdc, RG = 6.0 Ω) tf (N) (P) — — 20 37 40 74 Turn–On Delay Time (VDD = 10 Vdc, ID = 3.0 Adc, VGS = 10 Vdc, RG = 6.0 Ω) (VDD = 10 Vdc, ID = 2.0 Adc, VGS = 10 Vdc, RG = 6.0 Ω) td(on) (N) (P) — — 7.0 11 21 22 Rise Time (VDD = 10 Vdc, ID = 3.0 Adc, VGS = 10 Vdc, RG = 6.0 Ω) (VDD = 10 Vdc, ID = 2.0 Adc, VGS = 10 Vdc, RG = 6.0 Ω) tr (N) (P) — — 32 21 64 42 Turn–Off Delay Time (VDD = 10 Vdc, ID = 2.0 Adc, VGS = 10 Vdc, RG = 6.0 Ω) td(off) (N) (P) — — 27 45 54 90 Fall Time VGS = 10 Vdc, RG = 6.0 Ω) tf (N) (P) — — 21 36 42 72 Total Gate Charge (VDS = 16 Vdc, ID = 3.0 Adc, VGS = 10 Vdc) (VDS = 16 Vdc, ID = 2.0 Adc, VGS = 10 Vdc) QT (N) (P) — — 12.5 15 18 20 nC Gate–Source Charge (VDS = 16 Vdc, ID = 3.0 Adc, VGS = 10 Vdc) Q1 (N) (P) — — 1.3 1.2 — — Gate–Drain Charge (VDS = 16 Vdc, ID = 2.0 Adc, VGS = 10 Vdc) Q2 (N) (P) — — 2.8 5.0 — — VGS = 10 Vdc) Q3 (N) (P) — — 2.4 4.0 — — (1) Negative signs for P–Channel device omitted for clarity. (continued) (2) Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2%. (3) Switching characteristics are independent of operating junction temperature. |
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