ADP1051

Preliminary Technical Data

Rev. PrA | Page 8 of 17

ABSOLUTE MAXIMUM RATINGS

Table 2. Absolute Maximum Rating

Parameter

Rating

Supply Voltage (Continuous) VDD

4.2 V

Digital Pins: OUTA, OUTB, OUTC,

OUTD, SR1, SR2, PG/ALT#, SDA, SCL

VS- to AGND

−0.3 V to +0.3 V

VS, VF, OVP, RTD, ADD, CS1, CS2+,

CS2-

SYNI/FLGI, CTRL

Operating Temperature Range

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Junction Temperature

150 °C

Peak Solder Reflow Temperature

SnPb Assemblies (10 to 30 secs)

240 °C

RoHS Compliant Assemblies

(20 to 40 secs)

260 °C

ESD Charged Device Model

1.5 kV

ESD Human Body Model

5.0 kV

Stresses above those listed under Absolute Maximum Ratings may

cause permanent damage to the device. This is a stress rating only;

functional operation of the device at these or any other conditions

above those indicated in the operational section of this

specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

THERMAL RESISTANCE

soldered in a circuit board for surface-mount packages.

Table 3. Thermal Resistance

Package Type

Unit

24 Lead LFCSP

36.26

1.51

°C/W

SOLDERING

It is important to follow the correct guidelines when laying out the

PCB footprint for the ADP1051, and for soldering the part onto the

PCB. For detailed information about these guidelines, see the AN-

772 Application Note.

ESD CAUTION