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LSM330DLCTR 数据表(PDF) 1 Page - STMicroelectronics

部件名 LSM330DLCTR
功能描述  iNEMO inertial module: 3D accelerometer and 3D gyroscope
PDF  66 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

LSM330DLCTR 数据表(HTML) 1 Page - STMicroelectronics

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This is information on a product in full production.
September 2012
Doc ID 022162 Rev 2
1/66
66
LSM330DLC
iNEMO inertial module:
3D accelerometer and 3D gyroscope
Datasheet — production data
Features
Analog supply voltage: 2.4 V to 3.6 V
Digital supply voltage IOs: 1.8 V
Low power mode
Power-down mode
3 independent acceleration channels and 3
angular rate channels
±2 g/±4 g/±8 g/±16 g dynamically selectable
full scale
±250/±500/±2000 dps dynamically selectable
full scale
SPI/I2C serial interface (16-bit data output)
Programmable interrupt generator for free-fall
and motion detection
ECOPACK
® RoHS and “Green” compliant
Application
GPS navigation systems
Impact recognition and logging
Gaming and virtual reality input devices
Motion activated functions
Intelligent power saving for handheld devices
Vibration monitoring and compensation
Free-fall detection
6D orientation detection
Description
The LSM330DLC is a system-in-package
featuring a 3D digital accelerometer and a 3D
digital gyroscope.
ST’s family of MEMS sensor modules leverages
the robust and mature manufacturing processes
already used for the production of micromachined
accelerometers.
The various sensing elements are manufactured
using specialized micromachining processes,
while the IC interfaces are developed using a
CMOS technology that allows the design of a
dedicated circuit which is trimmed to better match
the sensing element characteristics.
The LSM330DLC has dynamically user-
selectable full scale acceleration range of
±2 g/±4 g/±8 g/±16 g and angular rate of
±250/±500/±2000 deg/sec.
The accelerometer and gyroscope sensors can
be either activated or separately put in Low
power/Power-down mode for applications
optimized for power saving.
The LSM330DLC is available in a plastic land grid
array (LGA) package.
Table 1.
Device summary
Part number
Temperature
range [°C]
Package Packing
LSM330DLC
-40 to +85
LGA-28L
(4x5x1.1
mm)
Tray
LSM330DLCTR
-40 to +85
Tape
and reel
LGA-28L (4x5x1.1 mm)
www.st.com


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