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STM32L152C6 数据表(PDF) 76 Page - STMicroelectronics |
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STM32L152C6 数据表(HTML) 76 Page - STMicroelectronics |
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76 / 121 page  Electrical characteristics STM32L151x6/8/B, STM32L152x6/8/B 76/121 Doc ID 17659 Rev 8 Designing hardened software to avoid noise problems EMC characterization and optimization are performed at component level with a typical application environment and simplified MCU software. It should be noted that good EMC performance is highly dependent on the user application and the software in particular. Therefore it is recommended that the user applies EMC software optimization and prequalification tests in relation with the EMC level requested for his application. Software recommendations The software flowchart must include the management of runaway conditions such as: ● Corrupted program counter ● Unexpected reset ● Critical data corruption (control registers...) Prequalification trials Most of the common failures (unexpected reset and program counter corruption) can be reproduced by manually forcing a low state on the NRST pin or the oscillator pins for 1 second. To complete these trials, ESD stress can be applied directly on the device, over the range of specification values. When unexpected behavior is detected, the software can be hardened to prevent unrecoverable errors occurring (see application note AN1015). Electromagnetic Interference (EMI) The electromagnetic field emitted by the device are monitored while a simple application is executed (toggling 2 LEDs through the I/O ports). This emission test is compliant with IEC 61967-2 standard which specifies the test board and the pin loading. Table 38. EMI characteristics Symbol Parameter Conditions Monitored frequency band Max vs. frequency range Unit 4 MHz voltage range 3 16 MHz voltage range 2 32 MHz voltage range 1 SEMI Peak level VDD = 3.3 V, TA = 25 °C, LQFP100 package compliant with IEC 61967-2 0.1 to 30 MHz 3 -6 -5 dBµV 30 to 130 MHz 18 4 -7 130 MHz to 1GHz 15 5 -7 SAE EMI Level 2.5 2 1 - |
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