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OMAP3530ECBBA 数据表(PDF) 1 Page - Texas Instruments

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部件名 OMAP3530ECBBA
功能描述  OMAP3530/25 Applications Processor: OMAP 3 Architecture
PDF  264 Pages
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制造商  TI1 [Texas Instruments]
网页  http://www.ti.com
标志 TI1 - Texas Instruments

OMAP3530ECBBA 数据表(HTML) 1 Page - Texas Instruments

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1
OMAP3530/25 Applications Processor
1.1 Features
OMAP3530/25 Applications Processor
www.ti.com
SPRS507F – FEBRUARY 2008 – REVISED OCTOBER 2009
Additional C64x+™ Enhancements
• OMAP3530/25 Applications Processor:
• Protected Mode Operation
OMAP™ 3 Architecture
• Exceptions Support for Error Detection
MPU Subsystem
and Program Redirection
• Up to 720-MHz ARM Cortex™-A8 Core
• Hardware Support for Modulo Loop
• NEON™ SIMD Coprocessor
Operation
High Performance Image, Video, Audio
• C64x+ L1/L2 Memory Architecture
(IVA2.2™) Accelerator Subsystem
32K-Byte L1P Program RAM/Cache (Direct
• Up to 520-MHz TMS320C64x+™ DSP
Mapped)
Core
80K-Byte L1D Data RAM/Cache (2-Way
• Enhanced Direct Memory Access
Set-Associative)
(EDMA) Controller (128 Independent
64K-Byte L2 Unified Mapped RAM/Cache
Channels)
(4-Way Set-Associative)
• Video Hardware Accelerators
32K-Byte L2 Shared SRAM and 16K-Byte L2
POWERVR SGX™ Graphics Accelerator
ROM
(OMAP3530 Device Only)
• C64x+ Instruction Set Features
• Tile Based Architecture Delivering up to
10 MPoly/sec
Byte-Addressable (8-/16-/32-/64-Bit Data)
• Universal Scalable Shader Engine:
8-Bit Overflow Protection
Multi-threaded Engine Incorporating
Bit-Field Extract, Set, Clear
Pixel and Vertex Shader Functionality
Normalization, Saturation. Bit-Counting
• Industry Standard API Support:
Compact 16-Bit Instructions
OpenGLES 1.1 and 2.0, OpenVG1.0
Additional Instructions to Support Complex
• Fine Grained Task Switching, Load
Multiplies
Balancing, and Power Management
• ARM Cortex™-A8 Core
• Programmable High Quality Image
ARMv7 Architecture
Anti-Aliasing
• Trust Zone®
Fully Software-Compatible With C64x and
• Thumb®-2
ARM9™
• MMU Enhancements
Commercial and Extended Temperature
Grades
In-Order, Dual-Issue, Superscalar
Microprocessor Core
• Advanced Very-Long-Instruction-Word (VLIW)
NEON™ Multimedia Architecture
TMS320C64x+™ DSP Core
Over 2x Performance of ARMv6 SIMD
Eight Highly Independent Functional Units
Supports Both Integer and Floating Point
• +Six ALUs (32-/40-Bit), Each Supports
SIMD
Single 32-Bit, Dual 16-Bit, or Quad 8-Bit
Jazelle® RCT Execution Environment
Arithmetic per Clock Cycle
Architecture
• Two Multipliers Support Four 16 x 16-Bit
Dynamic Branch Prediction with Branch
Multiplies (32-Bit Results) per Clock
Target Address Cache, Global History
Cycle or Eight 8 x 8-Bit Multiplies (16-Bit
Buffer, and 8-Entry Return Stack
Results) per Clock Cycle
Embedded Trace Macrocell (ETM) Support
Load-Store Architecture With Non-Aligned
for Non-Invasive Debug
Support
64 32-Bit General-Purpose Registers
• ARM Cortex™-A8 Memory Architecture:
Instruction Packing Reduces Code Size
16K-Byte Instruction Cache (4-Way
Set-Associative)
All Instructions Conditional
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this document.
POWERVR SGX is a trademark of Imagination Technologies Ltd.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright © 2008–2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.


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