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M24C64-R 数据表(PDF) 23 Page - STMicroelectronics |
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M24C64-R 数据表(HTML) 23 Page - STMicroelectronics |
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23 / 42 page ![]() M24C64-W M24C64-R M24C64-F M24C64-DF Maximum rating Doc ID 16891 Rev 27 23/42 7 Maximum rating Stressing the device outside the ratings listed in Table 5 may cause permanent damage to the device. These are stress ratings only, and operation of the device at these, or any other conditions outside those indicated in the operating sections of this specification, is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 5. Absolute maximum ratings Symbol Parameter Min. Max. Unit Ambient operating temperature –40 130 °C TSTG Storage temperature –65 150 °C TLEAD Lead temperature during soldering see note(1) 1. Compliant with JEDEC Std J-STD-020D (for small body, Sn-Pb or Pb assembly), the ST ECOPACK® 7191395 specification, and the European directive on Restrictions on Hazardous Substances (RoHS) 2002/95/EU. °C PDIP-specific lead temperature during soldering 260(2) 2. TLEAD max must not be applied for more than 10 s. °C VIO Input or output range –0.50 6.5 V IOL DC output current (SDA = 0) - 5 mA VCC Supply voltage –0.50 6.5 V VESD Electrostatic pulse (Human Body model)(3) 3. Positive and negative pulses applied on different combinations of pin connections, according to AEC- Q100-002 (compliant with JEDEC Std JESD22-A114, C1=100 pF, R1=1500 Ω). -4000 V |
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