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M24C64-R 数据表(PDF) 40 Page - STMicroelectronics |
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M24C64-R 数据表(HTML) 40 Page - STMicroelectronics |
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40 / 42 page ![]() Revision history M24C64-W M24C64-R M24C64-F M24C64-DF 40/42 Doc ID 16891 Rev 27 11 Revision history Table 25. Document revision history Date Revision Changes 14-Mar-2011 22 Updated information concerning E2, E1, E0 for the WLCSP package: – note under Figure 3: 5-bump WLCSP connections (top view) – comment under Figure 5: Device select code – note 3 under Table 2: Device select code 07-Apr-2011 23 Updated MLP8 package data and Section 10: Part numbering. Added footnote (a) in Section 4.5: Memory addressing. 18-May-2011 24 Updated: – Figure 3: 5-bump WLCSP connections (top view) – Table 5: Absolute maximum ratings – Small text changes Added: – Figure 12: Memory cell characteristics 08-Sep-2011 25 Updated: – Table 21: UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead 2 x 3 mm, data – Figure 14: Maximum Rbus value versus bus parasitic capacitance Cbus) for an I2C bus at maximum frequency fC = 1MHz – Figure 6: I2C Fast mode Plus (fC = 1 MHz): maximum Rbus value versus bus parasitic capacitance (Cbus). Added tWLDL and tDHWH in: – Table 16: 400 kHz AC characteristics – Table 17: 1 MHz AC characteristics – Figure : Minor text changes. |
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